发明名称 METHOD FOR DAMAGE-FREE JUNCTION FORMATION
摘要 <p>Embodiments of this doping method may be used to improve junction formation, An implant species, such as helium or another noble gas, is implanted into a workpiece to a first depth (204). A dopant is deposited on a surface of the workpiece. During an anneal, the dopant diffuses to the first depth. The noble gas ions may at least partially amorphize the workpiece during the implant. The workpiece may be planar or non-planar. The implant and deposition may occur in a system without breaking vacuum.</p>
申请公布号 WO2011153074(A1) 申请公布日期 2011.12.08
申请号 WO2011US38219 申请日期 2011.05.26
申请人 VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.;HATEM, CHRISTOPHER, R.;GODET, LUDOVIC 发明人 HATEM, CHRISTOPHER, R.;GODET, LUDOVIC
分类号 H01L21/223;H01L21/225;H01L21/265;H01L21/336 主分类号 H01L21/223
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