CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

摘要

A circuit board (100) and a manufacturing method thereof are provided. The circuit board (100) comprises at least one adhesive layer (120) and at least one transmission line (140), an air cavity (124) is formed in the adhesive layer (120), and an orthographic projection of the transmission line (140) is located in the area of the air cavity (124) of the adhesive layer (120).