| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method and a system (120) for use in processing objects such as wafers, including polishing and/or grinding wafers. <P>SOLUTION: A front-end module (124) couples with a storage device (126) that stores objects for processing. The front-end module (124) can comprise a single robot, a transfer station, and a plurality of end effectors. A processing module (122) is coupled with the front-end module (124) such that the single robot delivers objects from the storage device to the processing module (122). The processing module (122) comprises a rotating table, and a spindle with a carrier configured to retrieve the delivered object and process the object on the rotating table. <P>COPYRIGHT: (C)2012,JPO&INPIT |
