| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an apparatus for assembling chip devices (10) on wires (8a, 8b), each chip device (10) comprising two substantially parallel lateral walls, and a groove in one of the lateral walls for receiving the wires. <P>SOLUTION: An apparatus includes a pinching device (14) comprising two opposing surfaces (16a, 16b). The distance between the opposing surfaces is substantially constant and substantially equal to the distance between two lateral walls of a chip device. A wire feeder is configured to continuously feed a wire in contact with one of the opposing surfaces of the pinching device. Chip device feeders (20, 28) are configured to drive chip devices, one at a time, between the opposing surfaces, with their grooves turned towards the wire. The pinching device may comprise two cylindrical rollers (14a, 14b) having rotation axes substantially perpendicular to the wire. The opposing surfaces (16a, 16b) are formed by respective surfaces of the rollers. <P>COPYRIGHT: (C)2012,JPO&INPIT |
