发明名称 RESIN MOLDING METHOD, DIE DEVICE, AND RESIN MOLDED ARTICLE
摘要 Flow gates 5 capable of protruding and retracting are provided in a cavity 9 of a die 2 to control a resin filling path. The generation of welds or orientation lines in a resin flow pattern is allowed only in an area containing uneven portions outside a design surface but is not allowed in other areas. The area containing welds or orientation lines in a resin flow pattern is covered with a separate component having a design surface, thereby achieving a desired metallic appearance.
申请公布号 US2011300330(A1) 申请公布日期 2011.12.08
申请号 US201113102567 申请日期 2011.05.06
申请人 MATSUMURA KEIZOU;MARUICHI TAISHI;PANASONIC CORPORATION 发明人 MATSUMURA KEIZOU;MARUICHI TAISHI
分类号 B29C45/73;B29C45/26;B32B3/00;B32B3/10 主分类号 B29C45/73
代理机构 代理人
主权项
地址