PREPREG, METAL-CLAD LAMINATE, AND PRINTED CIRCUIT BOARD

摘要

The disclosed prepreg comprises a base material impregnated with a resin composition. Said resin composition contains: aluminum hydroxide with a mean particle diameter between 2.5 and 4.5 µm; and a glass filler with a mean particle diameter between 1.0 and 3.0 µm, a specific gravity between 2.3 and 2.6 g/cm³, and a SiO2 content between 50% and 65% by mass. The aluminum hydroxide and glass filler constitute a total of between 30% and 50% of the total solid mass of the resin composition. Using this prepreg, despite the use of aluminum hydroxide in parallel with an inorganic filler such as silica, a highly-workable metal-clad laminate with a low coefficient of thermal expansion and an inorganic filler uniformly dispersed therein can be produced.