发明名称 COMPOSITION FOR METAL ELECTROPLATING COMPRISING LEVELING AGENT
摘要 A composition comprising a source of metal ions and at least one leveling agent comprising a linear or branched, polymeric imidazolium compound comprising the structural unit of formula L1 (L1) wherein R1, R2, R3 are each independently selected from an H atom and an organic radical having from 1 to 20 carbon atoms, R4 is a divalent, trivalent or mutlivalent organic radical which does not comprise a hydroxyl group in the a or ß position relative to the nitrogen atom of the imidazole rings. is an integer.
申请公布号 WO2011151785(A1) 申请公布日期 2011.12.08
申请号 WO2011IB52385 申请日期 2011.05.31
申请人 BASF SE;SIEMER, MICHAEL;ROEGER-GOEPFERT, CORNELIA;MEIER, NICOLE;RAETHER, ROMAN, BENEDIKT;ARNOLD, MARCO;EMNET, CHARLOTTE;MAYER, DIETER;FLUEGEL, ALEXANDER;BASF (CHINA) COMPANY LIMITED 发明人 SIEMER, MICHAEL;ROEGER-GOEPFERT, CORNELIA;MEIER, NICOLE;RAETHER, ROMAN, BENEDIKT;ARNOLD, MARCO;EMNET, CHARLOTTE;MAYER, DIETER;FLUEGEL, ALEXANDER
分类号 C08L79/04;C25D3/52 主分类号 C08L79/04
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