ELECTRONIC CHIP HAVING CHANNELS THROUGH WHICH A HEAT TRANSPORT COOLANT CAN FLOW, ELECTRONIC COMPONENTS AND COMMUNICATION ARM INCORPORATING SAID CHIP

摘要

The invention relates to an electronic chip, comprising: a semiconductor substrate (6) having an active area (8) formed by at least one P doped region and at least one N doped region which form one or more P-N junctions through which most of the useful current flows when said electronic chip is in a conductive state, and at least one channel (44) through which a heat transport coolant can flow, the channel(s) passing through at least said P or N doped region of the active area. Each channel (44) is rectilinear and passes through the substrate (6) in a direction which is collinear with a direction F to the nearest ± 45°, where the direction F is perpendicular to the plane of the substrate.