EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide an embedded printed circuit board and a method of manufacturing the same capable of forming a cavity for embedding a chip on an insulating layer configured of a photosensitive film by an exposure and a development process.

SOLUTION: The present invention relates to an embedded printed circuit board and a method of manufacturing the same. The embedded printed circuit board includes: an insulating layer on which a cavity is formed; a chip mounted on the cavity; and a circuit layer formed on the insulating layer. The insulating layer is made of photosensitive compositions including photosensitive monomer and photoinitiator. The cavity can be formed selectively and only on the insulating layer, thereby making it possible to secure a degree of freedom in the design of the embedded printed circuit board.

COPYRIGHT: (C)2012,JPO&INPIT