Semiconductor Device and Method of Forming Shielding Layer After Encapsulation and Grounded Through Interconnect Structure

摘要

A method of manufacturing a semiconductor device includes providing a substrate having a conductive bump formed over the substrate and a semiconductor die with an active surface oriented to the substrate. An encapsulant is deposited over the semiconductor die and the conductive bump, and the encapsulant is planarized to expose a back surface of the semiconductor die opposite the active surface while leaving the encapsulant covering the conductive bump. A channel is formed into the encapsulant to expose the conductive bump. The channel extends vertically from a surface of the encapsulant down through the encapsulant and into a portion of the conductive bump. The channel extends through the encapsulant horizontally along a length of the semiconductor die. A shielding layer is formed over the encapsulant and the back surface of the semiconductor die. The shielding layer includes a docking pin extending into the channel and into the portion of the conductive bump to electrically connect to the conductive bump and provide isolation from inter-device interference.