发明名称 TEMPERATURE MEASUREMENT SYSTEM FOR A LIGHT EMITTING DIODE (LED) ASSEMBLY
摘要 A temperature measurement system is provided for a light emitting diode (LED) assembly that includes an LED having two semiconductors joined together at an LED junction. The system includes a temperature sensor operatively connected to the LED assembly at a remote location that is remote from the LED junction. The temperature sensor is configured to measure a temperature of the LED assembly at the remote location. A temperature calculation module is operatively connected to the temperature sensor for receiving the measured temperature at the remote location from the temperature sensor. The temperature calculation module is configured to determine a junction temperature at the LED junction based on the measured temperature a the remote location.
申请公布号 US2011301909(A1) 申请公布日期 2011.12.08
申请号 US20100794104 申请日期 2010.06.04
申请人 JACKSON STEVE;RIX ROBERT;PELTON BRUCE;AHMED MOHAMMAD S.;WEBER RONALD MARTIN;MOSTOLLER MATTHEW E.;TYCO ELECTRONICS CORPORATION 发明人 JACKSON STEVE;RIX ROBERT;PELTON BRUCE;AHMED MOHAMMAD S.;WEBER RONALD MARTIN;MOSTOLLER MATTHEW E.
分类号 G01K13/00;G06F15/00;H01L33/62 主分类号 G01K13/00
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