WIRE BONDING APPARATUS AND WIRE BONDING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a wire bonding apparatus and a wire bonding method capable of improving bondability of a lead frame by managing a heating time of the lead frame on which a semiconductor chip is mounted.

SOLUTION: The wire bonding apparatus includes: a lead frame loading unit 104 for loading a lead frame on which a semiconductor chip is mounted on a transfer rail 102; a heater block 106 for heating the loaded lead frame; a wire bonding tool 108 for wire-bonding the semiconductor chip and leads of the lead frame; a lead frame unloading unit 110 for unloading the wire-bonded lead frame from the transfer rail 102; and a control unit for detecting a wire bonding failure when the wire bonding failure occurs in the lead frame and separating the heater block 106 from the lead frame after a predetermined time has elapsed from the occurrence of the wire bonding failure.

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