| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board along with its mounting structure, capable of responding to the request for improved connection reliability with an electronic component. <P>SOLUTION: A wiring board 3 includes a base body 11, a plurality of insulating layers 14 stacked only on the upper surface side of the base body 11, a first connection pad 7a formed partially on the lower surface of the base body 11, a first conductive layer 10a formed partially between the base body 11 and the insulating layer 14 adjoining the base body 11, a second conductive layer 10b formed partially between the adjoining insulating layers 14, and a second connection pad 7b formed partially on the upper surface of the insulating layer 14 positioned at the top layer. The coefficient of thermal expansion of the base body 11 and the insulating layer 14 in planar direction is lower than that of the first connection pad 7a, the first conductive layer 10a, the second conductive layer 10b, and the second connection pad 7b in planar direction. The coefficient of thermal expansion of the insulating layer 14 in planar direction is lower than that of the base body 11 in planar direction. <P>COPYRIGHT: (C)2012,JPO&INPIT |
