发明名称 THERMOPLASTIC RESIN COMPOSITION, MOLDING THEREOF, AND METHOD FOR MOLDING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a thermoplastic resin composition having high melt strength and excellent molding processability; and a molding having excellent appearance obtained by molding the composition. <P>SOLUTION: This thermoplastic composition includes (A) 100 pts.wt. of a polymer having &ge;10,000 to less than 1,000,000 weight-average molecular weight, (B1) 0.5-15 pts.wt. of a polymer having &ge;1,000,000 to less than 10,000,000 weight-average molecular weight, and having 10-1,000 carboxy groups in the molecule, (B2) 0.5-15 pts.wt. of a polymer having &ge;1,000,000 to less than 5,000,000 weight-average molecular weight, and having 10-1,000 pieces of one or more groups selected from the group consisting of epoxy groups and oxetane groups. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011246655(A) 申请公布日期 2011.12.08
申请号 JP20100123280 申请日期 2010.05.28
申请人 KANEKA CORP 发明人 TOKIMOTO HIROOMI;SATO MITSUTAKE;KANDA SUEHIKO
分类号 C08L101/00;C08G81/00;C08J9/10;C08L33/00 主分类号 C08L101/00
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