发明名称 CUTTING DEVICE OF LAMINATED FILM BODY, AND CUTTING METHOD OF LAMINATED FILM BODY
摘要 <P>PROBLEM TO BE SOLVED: To provide a cutting device of a laminated film body capable of performing half cut in a state where a cutting edge of a cutting blade and a cutting cradle are kept further parallel to each other. <P>SOLUTION: This cutting device includes a cutting tool unit 7 for cutting a partial film out of a laminated film body, and is used for cutting the partial film out of the laminated film body with a plurality of films laminated therein by moving the cutting tool unit 7 along a cutting cradle 20 supporting the laminated film body. The cutting device includes a linear unit for adjusting the position of the cutting tool unit 7 with respect to the cutting cradle 20, a dial gage 12 for measuring a distance, and a controller for controlling the linear unit, wherein the controller is configured to control the linear unit so that the cutting direction of the cutting tool unit 7 with respect to the laminated film body is set parallel to the cutting cradle 20 based on distance information between the dial gage 12 and the cutting cradle 20 in the length direction of the cutting cradle 20 measured by the dial gage 12 and a displacement sensor. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011245607(A) 申请公布日期 2011.12.08
申请号 JP20100124130 申请日期 2010.05.31
申请人 SUMITOMO CHEMICAL CO LTD 发明人 KISHIZAKI KAZUNORI;UEDA KOJI
分类号 B26D3/08 主分类号 B26D3/08
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