| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board capable of maintaining a good connection between an electrode and a semiconductor device connecting pad of a semiconductor device, and having an excellent electrical connection reliability with the semiconductor device. <P>SOLUTION: A wiring board 10 comprises an insulating substrate 1; a wiring conductor layer 2 formed on a surface of the insulating substrate 1; an opening part 4a formed on the insulating substrate 1 and the wiring conductor layer 2, and exposing a part of the wiring conductor layer 2 as a semiconductor device connecting pad 3; a solder resist layer 4 coating the wiring conductor layer 2 around the semiconductor device connecting pad 3; and plated metal layer 6 covering a surface of the semiconductor device connecting pad 3. The plated metal layer 6 has a protrusion part 6a extending from the periphery of the semiconductor device connecting pad 3 to the middle of the side wall of the opening part 4a and adhered to the sidewall of the opening part 4a. <P>COPYRIGHT: (C)2012,JPO&INPIT |
