| 摘要 |
PURPOSE: A semiconductor device manufacturing method is provided to arrange a dummy pattern appropriate to the shape of a through-silicon via, thereby stably arranging the through-silicon via in a state in which multiple chips are laminated. CONSTITUTION: A first region is defined in order to arrange a through-silicon via penetrating a semiconductor chip. A second region is defined in order to actually arrange the through-silicon via within the first region. A dummy pattern(32) is arranged in a region excluding a third region(A1) among the first region. The dummy pattern(31) is arranged also in the inside of a fourth region(A2). The dummy pattern for wafer open adjustment is arranged based on a separated region with fixed intervals(d1,d2).
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