| 摘要 |
A light emitting structure includes a package body including a conductive material, a nonconductive layer formed on a surface of the package body, a plurality of electrodes on the nonconductive layer, a plurality of protrusions from the electrodes, a light emitting device mounted to a plane of the package body and connected to the electrodes, and a transmissive resin member to encapsulate the light emitting device wherein at least the plane of the package body other than where the light emitting device is seated is substantially flat. |
