发明名称 METHOD FOR PRODUCING A MULTILAYER PRINTED CIRCUIT BOARD, ADHESION PREVENTION MATERIAL AND MULTILAYER PRINTED CIRCUIT BOARD AND USE OF SUCH A METHOD
摘要 In a method for producing a multilayer printed circuit board from a plurality of conducting or conductive and non-conducting or insulating layers or plies to be connected to each other, in particular to be pressed together, wherein after connecting at least partially planar layers at least a partial region (11) thereof is removed, and wherein in order to prevent adherence of the partial region (11) to be removed a material (8) preventing adhesion is applied in accordance with the partial region to be removed onto a layer (9) which adjoins the partial region to be removed, it is provided that the material (8) preventing adhesion is formed by a mixture comprising a release agent on the basis of at least one metal soap, preferably the fatty acid salts of Al, Mg, Ca, Na and Zn, a binding agent, and a solvent, whereby a partial region to be removed can be removed easily and reliably after appropriate treatment and/or processing steps of the multilayer printed circuit board. In addition, an adhesion prevention material and a use of the method in connection with the production of a multilayer printed circuit board (1) are provided.
申请公布号 EP2392199(A1) 申请公布日期 2011.12.07
申请号 EP20100702812 申请日期 2010.01.22
申请人 DCC - DEVELOPMENT CIRCUITS & COMPONENTS GMBH 发明人 WEICHSLBERGER, GUENTHER;STAHR, JOHANNES;LEITGEB, MARKUS;ZLUC, ANDREAS;WEIDINGER, GERALD
分类号 H05K3/00 主分类号 H05K3/00
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