| 摘要 |
A technique, comprising defining at least part of one or more electronic devices on a substrate sheet 2 by means of one or more material removal processes, wherein the substrate sheet is arranged on a support 4 so as to overhang underlying adhesive and barrier layers 6, 8 more at a first end than at an opposite end; and removing loose stripper/etch residue material from under the overhang at the first end by directing a stream of gas at the substrate edge and the support edge from an outlet. The gas stream has a directional component parallel to the substrate surface. The removal of the residual material from below the overhang reduces defects generated during device fabrication, for example displays.
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