| 摘要 |
PURPOSE: A wafer polishing apparatus is provided to increase frictional force between a polishing pad and edge part of a wafer by a groove arranged on the polishing pad, thereby effectively polishing the wafer. CONSTITUTION: A wafer rotary part(10) supports a wafer(W). The wafer rotary part comprises a wafer chuck(11). A drum(30) relatively rotates with respect to the wafer. A grinding pad touches an edge part of the wafer. The grinding pad comprises a plurality of grooves. The shape of the grooves is extended in a direction intersecting the upper surface of the wafer.
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