发明名称 |
METHOD AND APPARATUS FOR PERFORMING RLC MODELING AND EXTRACTION FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT (3D-IC) DESIGNS |
摘要 |
One embodiment of the present invention provides a system that performs an RLC extraction for a three-dimensional integrated circuit (3D-IC) die. During operation, the system receives a 3D-IC die description. The system then transforms the 3D-IC die description into a set of 2D-IC die descriptions, wherein the transform maintains equivalency between the set of 2D-IC die descriptions and the 3D-IC die description. Next, for each 2D-IC die description in the set of 2D-IC die descriptions, the system performs an electrical property extraction using a 2D-IC extraction tool to obtain a 2D-IC RLC netlist file. The system then combines the set of 2D-IC RLC netlist files for the set of 2D-IC die descriptions to form an RLC netlist file for the 3D-IC die description. |
申请公布号 |
EP2392026(A2) |
申请公布日期 |
2011.12.07 |
申请号 |
EP20100736257 |
申请日期 |
2010.01.22 |
申请人 |
SYNOPSYS, INC. |
发明人 |
CHEN, QIUSHI;QIU, BEIFANG;CHIANG, CHARLES C.;HU, XIAOPING;KOSHY, MATHEW;BISWAS, BARIBRATA |
分类号 |
H01L23/12;G06F17/50;H01L23/20;H01L23/48;H01L23/552;H01L25/065 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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