| 摘要 |
PURPOSE: A semiconductor device and a microphone are provided to form a space in a packet by a back chamber of a microphone chip, thereby increasing sensitivity of the microphone chip. CONSTITUTION: A package is formed by overlapping a cover(44) with a substrate(45). A microphone chip(42) is installed on the upper side of a concave part of the cover. A circuit device(43) is installed on the upper side of a concave part(66) of the substrate. The microphone chip is located on the circuit device. The microphone chip is connected to a bonding pad installed on the bottom of the cover. The circuit device is connected to the bonding pad by a bonding wire(80). |
