| 发明名称 |
LED package and method of manufacturing the same |
| 摘要 |
<p>Provided is an LED package including a heat radiating portion that is composed of two or more metal layers and has a cavity formed therein; a first lead that extends from one side of the heat radiating portion; a second lead that is formed in the other side of the heat radiating portion so as to be separated from the heat radiating portion; a mold portion that fixes the heat radiating portion and the first and second leads; an LED chip that is mounted in the cavity; and a first filler that is filled in the cavity so as to protect the LED chip.</p> |
| 申请公布号 |
KR101088910(B1) |
申请公布日期 |
2011.12.07 |
| 申请号 |
KR20080050050 |
申请日期 |
2008.05.29 |
| 申请人 |
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发明人 |
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| 分类号 |
H01L33/52;H01L23/29;H01L23/31;H01L23/34;H01L33/48;H01L33/54;H01L33/56;H01L33/60;H01L33/62;H01L33/64 |
主分类号 |
H01L33/52 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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