发明名称 LED PACKAGE AND METHOD OF MANUFACTURING THE SAME
摘要 PURPOSE: LED package with a reflector and a manufacturing method thereof are provided to improve the light efficiency of an LED device which is mounted in an LED package by securing the roughness degree of a ceramic sheet to be less than about 0.3μm. CONSTITUTION: A mold(10) is prepared. An inclined structure(12) is integrally included within the mold. The gradient of the inclined plane formed in the cavity of a top ceramic sheet is easily controlled by adjusting the gradient of the inclined structure. A ceramic slurry(14) is filled in the mold. The ceramic slurry includes a solvent, a binder, and a plasticizer along with powder.
申请公布号 KR20110131380(A) 申请公布日期 2011.12.07
申请号 KR20100050785 申请日期 2010.05.31
申请人 KOMICO LTD. 发明人 CHOI, MYONG HO;CHOI, JIN SIK;PARK, JONG HOON;JUNG, SANG MOOK
分类号 H01L33/48;H01L33/60 主分类号 H01L33/48
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