发明名称 |
LED PACKAGE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
PURPOSE: LED package with a reflector and a manufacturing method thereof are provided to improve the light efficiency of an LED device which is mounted in an LED package by securing the roughness degree of a ceramic sheet to be less than about 0.3μm. CONSTITUTION: A mold(10) is prepared. An inclined structure(12) is integrally included within the mold. The gradient of the inclined plane formed in the cavity of a top ceramic sheet is easily controlled by adjusting the gradient of the inclined structure. A ceramic slurry(14) is filled in the mold. The ceramic slurry includes a solvent, a binder, and a plasticizer along with powder. |
申请公布号 |
KR20110131380(A) |
申请公布日期 |
2011.12.07 |
申请号 |
KR20100050785 |
申请日期 |
2010.05.31 |
申请人 |
KOMICO LTD. |
发明人 |
CHOI, MYONG HO;CHOI, JIN SIK;PARK, JONG HOON;JUNG, SANG MOOK |
分类号 |
H01L33/48;H01L33/60 |
主分类号 |
H01L33/48 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|