发明名称 |
Method of forming metal film and metal wiring pattern, undercoat composition for forming metal film and metal wiring pattern, and metal film |
摘要 |
A method of forming a metal film and a metal wiring pattern is described a step of forming an organic film by applying and polymerizing an undercoat composition for forming a metal film containing an addition-polymerizable monomer having an acidic group and a polymerization initiator on a substrate or film, a step of converting the acidic group into a metal (M1) salt by treating the organic film with an aqueous solution containing a metal (M1) ion, a step of converting the metal (M1) salt into a metal (M2) salt by treating the organic film with an aqueous solution containing a metal (M2) ion having an ionization tendency lower than the metal (M1) ion, and a step of forming a metal film on the organic film surface by reducing the metal (M2) ion. |
申请公布号 |
US8071178(B2) |
申请公布日期 |
2011.12.06 |
申请号 |
US20060917133 |
申请日期 |
2006.06.06 |
申请人 |
NAKAJIMA SEIJI;MORI TETSUYA;NAWAFUNE HIDEMI;OMRON CORPORATION |
发明人 |
NAKAJIMA SEIJI;MORI TETSUYA;NAWAFUNE HIDEMI |
分类号 |
C08F2/48;C08F2/50 |
主分类号 |
C08F2/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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