发明名称 THREE DIMENSIONAL CAMERA MODULE AND METHOD FOR MANUFACTURING THE SAME
摘要 PURPOSE: A three-dimensional camera module and manufacturing method thereof are provided to implement a three-dimensional camera module by the modulation process of a first image sensor chip and a second image sensor chip. CONSTITUTION: A first image sensor chip(110) takes a photograph of a left eye image. A second image sensor chip(120) takes a photograph of a right eye image. The first image sensor chip and the second image sensor chip are separated from a PCB(Printed Circuit Board)(100). A connector is electrically connected to the printed circuit board.
申请公布号 KR20110130953(A) 申请公布日期 2011.12.06
申请号 KR20100050532 申请日期 2010.05.28
申请人 LG INNOTEK CO., LTD. 发明人 SHIN, HONG SIK
分类号 H04N5/225;H04N13/00 主分类号 H04N5/225
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