发明名称 Method and apparatus for inserting metal fill in an integrated circuit (“IC”) layout
摘要 Some embodiments of the invention provide a method for inserting several fills in an integrated circuit (“IC”) layout. The method identifies a set of potential fills in a region of an IC layout, where the set of potential fills has a first fill size, wherein the first fill size is from a set of fill sizes. The method specifies a halo around each potential fill in the set of potential fills. For each potential fill, the method determines whether the specified halo overlaps with a foreign object in the region of the layout. For each potential fill, the method specifies a legal fill in the region of the IC layout if the specified halo does not overlap with a foreign object in the region of the IC layout. The method inserts at least one legal fill in the region of the IC layout. In some embodiments, the halo is a spacing halo.
申请公布号 US8074187(B2) 申请公布日期 2011.12.06
申请号 US20100731057 申请日期 2010.03.24
申请人 YLINEN JUDD MATTHEW;YUE KWOK MING;CANDENCE DESIGN SYSTEMS, INC. 发明人 YLINEN JUDD MATTHEW;YUE KWOK MING
分类号 G06F17/50 主分类号 G06F17/50
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