发明名称 Laser processing apparatus which can control length and intensity of laser beam
摘要 <p>The invention relates to a laser processing device, comprising a reaction chamber provided with a substrate inside and a quartz window at the upper side; a laser device installed outside the reaction chamber and at the top of the quartz window, radiating a curtain-shaped laser beam on the substrate; a laser beam separation unit installed between the laser device and the quartz, isolating side surface of the laser beam, horizontally moving along the longitudinal direction of the laser beam, and equipped at least at one of two ends of the laser beam. A photoelectric detector with a feedback unit receives a laser beam reflected by a beam isolation unit, measures the intensity and feeds back to the laser device, thereby controlling laser beam output intensity of the laser device. According to the invention, laser beam length radiating on the substrate can be controlled, and laser beam intensity can be controlled in real time during implementing process.</p>
申请公布号 KR101089624(B1) 申请公布日期 2011.12.06
申请号 KR20090057079 申请日期 2009.06.25
申请人 发明人
分类号 B23K26/00;H01L21/324;C21D1/26;C23C16/02 主分类号 B23K26/00
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