| 摘要 |
An electronic device with EMI screen and packaging process thereof to provide even active EMI prevention means includes adhesion of a transit substrate to a soldering surface of the electronic device, a protection circuit layer functioning as EMI screen being paved on the bottom of the transit substrate; a packaging circuit layer being laid; protection circuit layer and the transit substrate as well as the packaging and protection circuit layers being segregated with an insulation material; and solder balls provided with electric continuity to the protection circuit layer and the packaging circuit layer being respectively implanted as soldering points respectively for EMI grounding and linkage between the electronic device and a printed circuit.
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