| 摘要 |
PURPOSE: An integrated PCB(Printed Circuit Board) and a manufacturing method thereof are provided to produce a highly integrated embedded printed circuit board by increasing the area of a PCB in an internal layer. CONSTITUTION: A carrier substrate(30), in which a copper film(200a) is formed, is prepared(S1). The copper film and the carrier substrate are adhered with an adhesive layer(35)(S2). A bonding paste(40) is spread on an electric component bonded area on the copper film. Electric components(10, 20) are placed in an area in which the bonding paste is spread(S3). Each device is attached to the area in which the bonding paste is spread(S4). |
