发明名称 Apparatus and method for attaching substrates
摘要 An apparatus for attaching substrates includes an upper chamber for holding an upper substrate and a lower chamber for holding a lower substrate which is to be attached to the upper substrate. The lower chamber is moved up and down so as to come together with the upper chamber to form a sealed attaching space. A substrate receiving part is fixed to a frame of the apparatus so that it does not move as the lower chamber is raised and lowered. The substrate receiving part alternatively projects from the lower chamber is the lower chamber is moved down, or is recessed into the top of the lower chamber when the lower chamber is lifted up.
申请公布号 US8072573(B2) 申请公布日期 2011.12.06
申请号 US20100957780 申请日期 2010.12.01
申请人 HWANG JAE SEOK;KIM KYUNG MI;ADP ENGINEERING CO., LTD. 发明人 HWANG JAE SEOK;KIM KYUNG MI
分类号 G02F1/1339;B23K37/00 主分类号 G02F1/1339
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