发明名称 Surface acoustic wave device
摘要 A highly reliable surface acoustic wave device includes wiring lines that do not easily rupture at a three-dimensional wiring portion. The surface acoustic wave device includes a plurality of surface acoustic wave elements located on a piezoelectric substrate, a supporting member arranged on the piezoelectric substrate so as to enclose vibrating portions including electrodes such as IDT electrodes, and a cover member stacked so as to cover openings of the supporting member and to define hollow spaces facing vibrating electrodes. Furthermore, a three-dimensional wiring portion at which a first wiring line and a second wiring line are stacked with an insulating layer interposed therebetween is provided on the piezoelectric substrate. The three-dimensional wiring portion is enclosed by the supporting member, and thereby disposed inside a space enclosed by the piezoelectric substrate, the supporting member, and the cover member.
申请公布号 US8072118(B2) 申请公布日期 2011.12.06
申请号 US20100878175 申请日期 2010.09.09
申请人 OMOTE RYOICHI;TAKADA NORIHIKO;MURATA MANUFACTURING CO., LTD. 发明人 OMOTE RYOICHI;TAKADA NORIHIKO
分类号 H03H9/25;H01L41/053 主分类号 H03H9/25
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