发明名称 |
PHOTOCURABLE RESIN AND PHOTOCURABLE RESIN COMPOSITION |
摘要 |
Disclosed is a photocurable resin (A) which has a molecular structure represented by general formula (I). Also disclosed is a carboxyl group-containing photocurable resin (A') which is produced by reacting the photocurable resin (A) with an acid anhydride (d). Further disclosed is a photocurable resin composition which comprises the photocurable resin (A) and/or the carboxyl group-containing photocurable resin (A') and a photopolymerization initiator (B) as the essential components. (In the formula, Ac represents a (meth)acryloyloxy group; R1 represents a residue of an epoxy compound (a), which contains an ethylene group produced by the ring opening of an epoxy group in the compound (a); R2 represents a joint part containing a carbonyloxy group or an urethane bond; n represents an integer of 1 to 99; and m represents 0 or 1.) |
申请公布号 |
KR20110131270(A) |
申请公布日期 |
2011.12.06 |
申请号 |
KR20117023559 |
申请日期 |
2010.04.09 |
申请人 |
TAIYO HOLDINGS CO., LTD.;DIC CORPORATION |
发明人 |
CHUJO TAKAYUKI;OKAMOTO DAICHI;ITO NOBUHITO;ARIMA MASAO;MURATA YOSHIAKI |
分类号 |
C08G18/81;C08F290/02;C08F299/02;C08G59/14 |
主分类号 |
C08G18/81 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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