| 摘要 |
PURPOSE: An embedded printed circuit board and a manufacturing method thereof are provided to reduce process costs by connecting a part to a solder without a separate surface process. CONSTITUTION: A plurality of insulating barriers(121) forms opening on a first metal layer at regular intervals. The first metal layer comprises a circuit pattern(111). An insulating film is formed on the first metal layer. An insulating barrier and the opening in which a first metal layer is exposed are formed by processing the insulating film using laser. Terminals of electronic device chips(140,150) are combined in the opening between the insulating barriers by the media of a solder member. The electronic device chip is buried in the first insulation layer. A second metal layer is included on the top of the first insulation layer. The second metal layer comprises a circuit pattern(191).
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