MULTILAYER ADHESIVE FILM FOR SEMICONDUCTOR PACKAGE

摘要

PURPOSE: An adhesive film for the semiconductor package is provided to prevent a chip crack or the pattern damage of the top of a chip caused by the gathering of inorganic particles because of non-including inorganic particles in an adhesive layer. CONSTITUTION: An adhesive film for semiconductor package comprises a base material layer, a tckifying layer, and an adhesive layer. The adhesive layer comprises a thermoplastic resin, and thermosetting resin including an epoxy resin of which softening point is 30-100°C, and a hardener of which softening point is above 120°C. The hardener is phenol resin which is chemical formula 1. In the chemical formula 1, R1 are similar or different each other. R1 are hydrogen, a C1-10 linear chain or branched chain alkyl, a cyclic alkyl, a hydroxyl, or an aryl. R2 is phenol, cresol, or aminotriazine. n is the integer of 1-3.