发明名称 Method of forming vertical structure light emitting diode with heat exhaustion structure
摘要 The present invention is to provide a method of forming a vertical structure light emitting diode with a heat exhaustion structure. The method includes steps of: a) providing a sapphire substrate; b) depositing a number of protrusions on the sapphire substrate, each of which has a height of p; c) forming a buffer layer having a number of recesses, each of which has a depth of q smaller than p so that when the protrusions are accommodated within the recesses of the buffer layer, a number of gaps are formed therebetween for heat exhaustion; d) growing a number of luminescent layers on the buffer layer, having a medium layer formed between the luminescent layers and the buffer layer; e) etching through the luminescent layers and the buffer layer to form a duct for heat exhaustion; f) removing the sapphire substrate and the protrusions by excimer laser lift-off (LLO); g) roughening the medium layer; and h) depositing electrodes on the roughened medium layer.
申请公布号 US8071401(B2) 申请公布日期 2011.12.06
申请号 US20090634747 申请日期 2009.12.10
申请人 CHEN SHIUE-LUNG;FENG JENG-KUO;CHANG JEAN CHING-HWA;CHEN JANG-HO;WALSIN LIHWA CORPORATION 发明人 CHEN SHIUE-LUNG;FENG JENG-KUO;CHANG JEAN CHING-HWA;CHEN JANG-HO
分类号 H01L21/00 主分类号 H01L21/00
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