发明名称 |
Method for the wet-chemical treatment of a semiconductor wafer |
摘要 |
A method for the wet-chemical treatment of a semiconductor wafer involves: a) rotating a semiconductor wafer; b) applying a cleaning liquid comprising gas bubbles having a diameter of 100 μm or less to the rotating wafer such that a liquid film forms on the wafer; c) exposing the rotating semiconductor wafer to a gas atmosphere containing a reactive gas; and d) removing the liquid film from the wafer. |
申请公布号 |
US8070882(B2) |
申请公布日期 |
2011.12.06 |
申请号 |
US20080326969 |
申请日期 |
2008.12.03 |
申请人 |
SCHWAB GUENTER;ZAPILKO CLEMENS;BUSCHHARDT THOMAS;FEIJOO DIEGO;HAIBARA TERUO;MORI YOSHIHIRO;SILTRONIC AG |
发明人 |
SCHWAB GUENTER;ZAPILKO CLEMENS;BUSCHHARDT THOMAS;FEIJOO DIEGO;HAIBARA TERUO;MORI YOSHIHIRO |
分类号 |
B08B7/00 |
主分类号 |
B08B7/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|