| 摘要 |
<p>PURPOSE: A slave wafer for stack package semiconductor memory and a manufacturing method of a stack package semiconductor memory thereof are provided to perform a level test of slave wafer by implementing a peripheral circuit test block in the scribe lane of the slave wafer. CONSTITUTION: In a slave wafer for stack package semiconductor memory and a manufacturing method of a stack package semiconductor memory thereof, a scribe lane(320) divides a plurality of dies(310). A plurality of dies comprises a memory cell block. A peripheral circuit test block for testing the operation of a plurality of dies in the scribe lane. The peripheral circuit test block is arranged in the scribe lane in a die group comprised of four dies(310A,310B,310C,310D). The die group is determined in consideration of the area of the peripheral circuit test block.</p> |
