METHOD FOR MANUFACTURING ORGANIC ELECTRONIC DEVICE

摘要

PURPOSE: An organic electronic device manufacturing method is provided to execute a cathode formation process and an encapsulation process at the same time by combining a cathode with a barrier film. CONSTITUTION: A metal electrode layer is formed on a surface energy controlling layer(S20). A barrier layer is formed on a second substrate(S40). A bonding layer is formed on the barrier layer(S50). The metal electrode layer of a first substrate and the bonding layer of the second substrate which are compressed while being faced each other are heated and cooled. The metal electrode layer of the first substrate and the bonding layer of the second substrate are separated into the first substrate and the second substrate and a pattern of the metal electrode layer of the first substrate is transferred to the bonding layer of the second substrate(S60). An organic layer is formed in a third substrate(S70). The bonding layer of the second substrate is compressed to the organic layer of the substrate and heated(S80).