Laser Cutting Apparatus for Lead Frame and Connector and Laser Cutting Method using the Same

摘要

PURPOSE: A laser machining apparatus for a lead frame and a connector is provided to maintain a smooth surface for the following plating process by eliminating oxide and scattered materials produced on a cut part of a lead frame through a dry laser grinding process. CONSTITUTION: A laser machining apparatus for a lead frame and a connector comprises a light source(102) and a laser irradiating part(101). The laser irradiating part is horizontally transferred on a guide rail and projects laser beam from the light source to outside through an optical unit. The optical unit comprises a reflective mirror and a prism module(110) which deviates the optical path of laser beam reflected by the reflective mirror from the central axis of the laser irradiating part. The laser beam(135) projected from the laser irradiating part forms a linear or arc circuit pattern on a printed circuit board.