| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor module capable of reducing the number of wires and the number of signal terminals for connection to a pad for temperature sensing, and being miniaturized. <P>SOLUTION: The semiconductor module includes first and second semiconductor switching elements 21a and 21b, connected in series, and first and second metal frames 23a and 23b on which the first and second semiconductor switching element 21a and 21b are mounted respectively. A temperature measuring element 25 is formed on at least one semiconductor switching element 21a of the first and second semiconductor switching elements. Molding by resin-sealing is so made as to encapsulate the first and second semiconductor switching elements 21a and 21b as well as the first and second metal frames 23a and 23b. A temperature measuring terminal 22b is connected only to the temperature measuring element 25 of one semiconductor switching element 21a of the first and second semiconductor switching elements 21a and 21b. <P>COPYRIGHT: (C)2012,JPO&INPIT |
