| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting device capable of simplifying a manufacturing process while ensuring high reliability and durability, and to provide a method of manufacturing the same. <P>SOLUTION: The semiconductor light-emitting device comprises: a wiring substrate 2: a plurality of semiconductor light-emitting elements 4 that are mounted on the wiring substrate and have emission properties with a predetermined wavelength range; a sealant 3 that has a predetermined light transmission characteristics, is formed in a plate shape so as to have a first surface and a second surface opposite to the first surface, and has a plurality of cavities recessed, in the first surface, corresponding to the plurality of semiconductor light-emitting elements; and fluorescent sections 6 that are filled in each of the cavities and include fluorescent material performing wavelength conversion of at least a part of light emitted from the semiconductor light-emitting elements. The first surface of the sealant is bonded to the surface on which semiconductor light-emitting elements of the wiring substrate are mounted, so that each of the plurality of semiconductor light-emitting elements are covered with the fluorescent sections in the corresponding cavities. <P>COPYRIGHT: (C)2012,JPO&INPIT |
