| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a system and a method for testing tensile strength of a bond formed from a ball or a bump of molten material such as solder. <P>SOLUTION: A device for testing tensile strength of a bond including a solder ball or bump in a semiconductor assembly comprises a probe having a longitudinal axis, a heater for heating the probe tip to the fusion temperature of the bond or higher, a holder for supporting the probe, an actuating device for ascending and descending the holder and the probe supported in the holder, a means for exerting tensile force on the holder so as to exerting the tensile force on the probe along the longitudinal axis, and a force measurement system for measuring the force exerted on the probe during tensile test. <P>COPYRIGHT: (C)2012,JPO&INPIT |
