发明名称 VINYL POLYMER POWDER, CURABLE RESIN COMPOSITION AND CURED SUBSTANCE
摘要 Disclosed is a vinyl polymer powder which is superior to dispersibility to curable resin compositions, which immediately gives a gel state for curable resin compositions by short-time heating with predetermined temperature, which is with high ion concentration, and which is useful as a pre-gel agent suitable for fields of electronic materials, to provide a curable resin composition comprising the vinyl polymer powder, and to provide a cured substance of the curable resin composition. The vinyl polymer powder of the present invention has an acetone-soluble component of 30% by mass or more, mass average molecular weight of the acetone-soluble component of 100,000 or more, a content of an alkali metal ion of 10 ppm or less, and a volume average primary particle size (Dv) of 200 nm or more.
申请公布号 US2011294954(A1) 申请公布日期 2011.12.01
申请号 US201013148138 申请日期 2010.02.04
申请人 MITSUBISHI RAYON CO., LTD. 发明人 FUKUTANI KAORI;KASAI TOSHIHIRO
分类号 C08F265/06;C08J3/12;C08L33/06;C08L33/14;C08L63/00 主分类号 C08F265/06
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