发明名称 |
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
According to one embodiment, a semiconductor device includes a switch element provided in a surface area of a semiconductor substrate, a contact plug with an upper surface and a lower surface, and a function element provided on the upper surface of the contact plug. The lower surface of the contact plug is connected to the switch element. The upper surface of the contact plug has a maximum roughness of 0.2 nm or less. |
申请公布号 |
US2011294291(A1) |
申请公布日期 |
2011.12.01 |
申请号 |
US201113035546 |
申请日期 |
2011.02.25 |
申请人 |
MATSUI YUKITERU;MINAMIHABA GAKU;EDA HAJIME;IWAYAMA MASAYOSHI;AMANO MINORU;YOSHIKAWA MASATOSHI;SATO MOTOYUKI;SUGURO KYOICHI;KODERA MASAKO;KABUSHIKI KAISHA TOSHIBA |
发明人 |
MATSUI YUKITERU;MINAMIHABA GAKU;EDA HAJIME;IWAYAMA MASAYOSHI;AMANO MINORU;YOSHIKAWA MASATOSHI;SATO MOTOYUKI;SUGURO KYOICHI;KODERA MASAKO |
分类号 |
H01L21/768 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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