发明名称 JOINING METHOD, JOINING DEVICE, AND JOINED BODY
摘要 <P>PROBLEM TO BE SOLVED: To join even various joining materials such as gold plating and copper having high laser reflectivity in high speed, high quality, and high stability with a simple structure. <P>SOLUTION: Two members are joined by laser irradiation using a pressurizing tool 2 heated by absorbing a laser beam 1 while squashing one member, which enables thermal diffusion joining in a condition that a junction area is expanded. Therefore, the various joining materials such as gold plating and copper having high laser reflectivity can be joined in high speed, high quality, and high stability with the simple structure. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011240346(A) 申请公布日期 2011.12.01
申请号 JP20100111583 申请日期 2010.05.14
申请人 PANASONIC CORP 发明人 SAKURAI TSUTOMU;WATANABE KAZUYUKI;MATSUKAWA NORIYUKI;FUNAZAKI KAZUYA;NISHIKAWA YUKIO
分类号 B23K26/20;B23K26/00;B23K26/18;B23K26/32 主分类号 B23K26/20
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