| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package for housing an element that improves insertion of an input/output terminal into a cut portion, and an electronic device equipped with the same. <P>SOLUTION: The package comprises: a base body 1 having a mounting part 1a which has an optical semiconductor element mounted on an upper main surface via a thermoelectric cooling element; a frame body 2 joined to the upper main surface to surround the mounting part, and having a fitting part for the input/output terminal 3 formed by penetrating or cutting a side wal;, and an input/output terminal having a flat-plate type projection inside the frame body, the input/output terminal including a first wiring conductor layer connected to a lead wire of the thermoelectric cooling element and a second wiring conductor layer connected to the optical semiconductor element on an upper surface of the projection, and being fitted to the frame body. The input/output terminal has a cut part, which is provided penetrating the projection vertically and has a reverse tapered part gradually widening toward a side face of the projection in plan view and into which the lead wire of the thermoelectric cooling element is inserted, in a formation part of the first wiring conductor layer inside the frame body. <P>COPYRIGHT: (C)2012,JPO&INPIT |
