SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To improve a package density by enhancing degrees of freedom of a chip layout in a semiconductor device.

SOLUTION: Performing reverse bonding in a layered manner by means of ball bonding enables wires in 2 directions to be formed on a pad 4a of a memory chip 4 to produce an equivalent effect to sequential stitch bonding of wedge bonding in ball bonding. This can enhance the degrees of freedom of a chip layout and a lead layout of a substrate 3 to improve the package density on the substrate in a chip lamination type-semiconductor device (memory card).

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