发明名称 HEAT-CONDUCTIVE MOLDING
摘要 <P>PROBLEM TO BE SOLVED: To provide a heat-conductive molding which is excellent in the heat-conduction performance, and whose handleability can easily be enhanced. <P>SOLUTION: The heat-conductive molding 11 is interposed and used between a heat generating body and a heat dissipating body, and is molded of a heat-conductive polymer composition containing a polymer matrix 12 and a heat-conductive filler 13. The heat-conductive filler 13 contains a fibrous filler 14 oriented in a fixed direction. In the heat-conductive molding 11, on the outer surface 16 crossing the orientation direction of the fibrous filler 14, the end of the fibrous filler 14 is exposed in the state crossing the outer surface 16. The heat-conductive molding 11 is interposed between the heat generating body and the heat dissipating body at the use time such that the outer surface 16 is contacted with at least one of the heat generating body and the heat dissipating body. The end of the exposed fibrous filler 14 is relatively immersed into the polymer matrix 12 in the heat-conductive molding 11 at the use time of the heat-conductive molding 11. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011241403(A) 申请公布日期 2011.12.01
申请号 JP20110151541 申请日期 2011.07.08
申请人 POLYMATECH CO LTD 发明人 OTA MITSURU;SHIMOYAMA NAOYUKI
分类号 C08J5/10;C09K5/08 主分类号 C08J5/10
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